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Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology

Received: 1 September 2014     Accepted: 25 October 2014     Published: 28 November 2014
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Abstract

As the VLSI technology scales down, significant challenges are facing the fabrication, modeling, and performance of the integrated circuits. One of the major challenges for the continuiation of the Moore’s law is “interconnects” at nano-scale. Interconnects become as important as transistors in the current technologies and will dominate the chip performance at the future technologies. Beside their eletrical performance, their mechanical performnace will be important at the nano-scale. Wires should be resilient enough to cope with Back-End-Of-Line (BEOL) processes. Nano-technology has offered us many solutions to current technology problems. One of the major gift of this technology is Carbon Nanotubes (CNT). CNTs are a promising candidate to replace copper interconnects. They not only provide us with ballistic transport for semiconductors, but also have better mechanical performance. In this paper, we study the mechanical reliability of the CNT interconnects and compare it with their copper conterparts.

Published in Science Journal of Circuits, Systems and Signal Processing (Volume 3, Issue 4)
DOI 10.11648/j.cssp.20140304.11
Page(s) 26-30
Creative Commons

This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.

Copyright

Copyright © The Author(s), 2014. Published by Science Publishing Group

Keywords

Copper Nano-Wire, Carbon Nanotubes, Fault Tolerance, Interconnections, VLSI

References
[1] M. Haykel, K. Moselund, D. bouver , 2005, Fault Tolerant Multi Level Logic Decoder for Nanoscale Crossbar Memory Arrays, Integerted Systems Laboratory Switzerland.
[2] M. Heyken Ben Jama, 2009, Fabrication and Design of Nanoscale Regular Circuits, International Conference on Nano Networks.
[3] Y. Jin, F. Yuan, 2003, Simulation of elastic properties of single-walled carbon nanotubes, North Carolina State University.
[4] H. Heidari, S. Mirza Kochaky , M. Babai , 2008, Simulation of Model For Reliability of Nano Wire in Field Programmable Nanowire Interconnect Electronic, Engineering Department of Elmo Sanat University.
[5] K. Banerjee, N. Srivastava , 2006, Are Carbon Nanotubes the Future of VLSI Interconnections?, San Francisco.
[6] A. Coker, 2008, Performance Analysis of Fault-tolerant Nano-Electronic Memories, Texas A&M University.
Cite This Article
  • APA Style

    Behzad Lotfy, Houshang Salehi. (2014). Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology. Science Journal of Circuits, Systems and Signal Processing, 3(4), 26-30. https://doi.org/10.11648/j.cssp.20140304.11

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    ACS Style

    Behzad Lotfy; Houshang Salehi. Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology. Sci. J. Circuits Syst. Signal Process. 2014, 3(4), 26-30. doi: 10.11648/j.cssp.20140304.11

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    AMA Style

    Behzad Lotfy, Houshang Salehi. Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology. Sci J Circuits Syst Signal Process. 2014;3(4):26-30. doi: 10.11648/j.cssp.20140304.11

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  • @article{10.11648/j.cssp.20140304.11,
      author = {Behzad Lotfy and Houshang Salehi},
      title = {Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology},
      journal = {Science Journal of Circuits, Systems and Signal Processing},
      volume = {3},
      number = {4},
      pages = {26-30},
      doi = {10.11648/j.cssp.20140304.11},
      url = {https://doi.org/10.11648/j.cssp.20140304.11},
      eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.cssp.20140304.11},
      abstract = {As the VLSI technology scales down, significant challenges are facing the fabrication, modeling, and performance of the integrated circuits. One of the major challenges for the continuiation of the Moore’s law is “interconnects” at nano-scale. Interconnects become as important as transistors in the current technologies and will dominate the chip performance at the future technologies. Beside their eletrical performance, their mechanical performnace will be important at the nano-scale. Wires should be resilient enough to cope with Back-End-Of-Line (BEOL) processes. Nano-technology has offered us many solutions to current technology problems. One of the major gift of this technology is Carbon Nanotubes (CNT). CNTs are a promising candidate to replace copper interconnects. They not only provide us with ballistic transport for semiconductors, but also have better mechanical performance. In this paper, we study the mechanical reliability of the CNT interconnects and compare it with their copper conterparts.},
     year = {2014}
    }
    

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    T1  - Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology
    AU  - Behzad Lotfy
    AU  - Houshang Salehi
    Y1  - 2014/11/28
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    DO  - 10.11648/j.cssp.20140304.11
    T2  - Science Journal of Circuits, Systems and Signal Processing
    JF  - Science Journal of Circuits, Systems and Signal Processing
    JO  - Science Journal of Circuits, Systems and Signal Processing
    SP  - 26
    EP  - 30
    PB  - Science Publishing Group
    SN  - 2326-9073
    UR  - https://doi.org/10.11648/j.cssp.20140304.11
    AB  - As the VLSI technology scales down, significant challenges are facing the fabrication, modeling, and performance of the integrated circuits. One of the major challenges for the continuiation of the Moore’s law is “interconnects” at nano-scale. Interconnects become as important as transistors in the current technologies and will dominate the chip performance at the future technologies. Beside their eletrical performance, their mechanical performnace will be important at the nano-scale. Wires should be resilient enough to cope with Back-End-Of-Line (BEOL) processes. Nano-technology has offered us many solutions to current technology problems. One of the major gift of this technology is Carbon Nanotubes (CNT). CNTs are a promising candidate to replace copper interconnects. They not only provide us with ballistic transport for semiconductors, but also have better mechanical performance. In this paper, we study the mechanical reliability of the CNT interconnects and compare it with their copper conterparts.
    VL  - 3
    IS  - 4
    ER  - 

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Author Information
  • Department of Engineering, Hakim Nezami High Education Institute, Qouchan, Iran

  • Department of Engineering, Hakim Nezami High Education Institute, Qouchan, Iran

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